The green light laser marking machine is a precision marking device utilizing a 532nm wavelength laser, suitable for the ultra-fine marking and cutting of heat-sensitive materials, glass, silicon wafers, and reflective metals.
Characterized by a smaller spot diameter, more concentrated energy, and a minimal heat-affected zone, it offers excellent marking contrast and is ideally suited for applications in precision electronics and high-end glass processing.
| Item | Green light laser marking machine |
| Laser Wavelength | 532nm |
| Laser Power | 15w |
| Laser beam quality（㎡） | ≤1.2 |
| Pulse Repetition Frequency | 10 kHz – 200 kHz (Adjustable) |
| Pulse Width | ＜30ns |
| Marking range | 110*110mm,175*175mm(optional) |
| Maximum Linear Velocity | ≤10000mm/s |
| Min Line Width | 0.01mm |
| Minimum Character | 0.1mm |
| Repeatability | ±0.002mm |
| Cooling system | Water cooling |
| Voltage | AC 220V / 50Hz / 10A |
| Total Consumption | 2Kw |
High Precision: Operating at a wavelength of 532nm—within the mid-range green laser spectrum—it produces a smaller focused spot, enabling marking with a precision of less than 10 microns.
Low Thermal Impact: Compared to infrared lasers, green lasers generate lower thermal input, making them ideal for heat-sensitive materials and preventing surface damage.
High Beam Quality: Featuring an advanced cavity design, it delivers exceptional beam quality and stability.
Versatile Material Compatibility: Particularly well-suited for marking glass, ceramics, most plastics, flexible PCBs, and metal surfaces.
Glass Processing: Fine marking on items such as mobile phone glass covers, automotive glass, decorative glass products, and medical devices.
Electronics Industry: Marking on silicon wafers, electronic components, microchips, and precision instruments.
High-End Marking: High-definition, high-resolution marking—both rigid and flexible—on the surfaces of various packaging bottles (glass and plastic).
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