PCB BOARD INLINE LASER CUTTING MACHINE

PCB laser cutting machine using a 355nm high-power ultraviolet laser cold light source, non-contact cold processing is performed through a micron-level focused spot, which effectively solves the problems of carbonization, burrs and heat-affected zones in PCB/FPC depaneling. It is especially suitable for FPC flexible boards, precision component cutting.

Power: 20w

Type: Inline PCB laser cutting machine

Model: JL-UV20-P

Descriptions

Item	Inline line UV Laser Machine
Model	JH-UV20-P
Laser Generator	UV laser-355nm
Machine design	Integrated Closed Cabinet
Cutting Accuracy	±0.1mm
Repeated Accuracy	±0.05mm
CCD Positioning accuracy	0.02mm
Cutting Efficiency	≤25s（75*75mm，30bit，DMcode）
Maximum PCB Size	520*520mm
Flue Dust Retaine	The machine has a dust extraction port, which can dock with the central dust removal of the factory or independent smoke purifier
Positioning system	CCD Camera with Visual positioning software
Feed direction	Different directions can be set
Air Pressure	0.5-0.8Kpa, 30L-60L/min, Ouality (solid particle, water,gas):(2.2.3-2.4.3) ISO8573
Voltage	220-250V/50-60Hz，32A, 3KW
Water chiller	Automatic water chiller (pure or distilled water)
Weight	650kg

PCB BOARD INLINE LASER CUTTING MACHINE DETAILS:

The laser beam’s effect on the PCB surface is primarily through thermal effects, evaporating or heating the surface coating or oxide layer to mark the PCB surface.

Machine type: Automatic PCB laser cutting machine (Depaneling machine)

Cutting range: any position on PCB

Function: Separated depanelized PCB from non-use part

Maximum working range: 520*520mm(adjustable)

PCB BOARD INLINE LASER CUTTING MACHINE FEATURES:

Cold Processing: Minimal heat-affected zone, preventing substrate deformation, delamination, or circuit melting due to high temperatures, ensuring smooth and even edges.

Ultra-fine Cutting: Focused spot diameter is small, enabling the cutting of complex geometries with high precision and no residue.

High Precision and High Efficiency: Equipped with CCD automatic positioning and a high-speed galvanometer, providing high stability and suitability for high-precision production.

Wide Range of Applicable Materials: Not limited to rigid PCBs, but also suitable for precision cutting and drilling of brittle or sensitive materials such as FPC, PI film, cover film, ceramic sheets, and PET film.

Fully Automated: Supports automatic CCD vision alignment and software-based automatic control, allowing integration into production lines.

Main application areas: PCB/FPC depaneling, precision electronic component cutting, micron-level drilling of flexible boards and ceramic sheets, cutting of PI film and PET film.