
Using a 355nm high-power ultraviolet laser cold light source, non-contact cold processing is performed through a micron-level focused spot, which effectively solves the problems of carbonization, burrs and heat-affected zones in PCB/FPC depaneling. It is especially suitable for FPC flexible boards, copper-clad boards, blind hole drilling and precision component cutting.
Power:15w
Type: Inline PCB laser cutting machine
Model: JL-UV15-P
| Item | Inline UV Laser Cutting Machine
|
| Model
|
JH-UV15-P |
| Laser Generator | UV laser-355nm |
| Machine design | Integrated Closed Cabinet |
| Cutting Accuracy
|
±0.1mm |
| Repeated Accuracy | ±0.05mm |
| CCD Positioning accuracy | 0.02mm
|
| Cutting Efficiency
|
≤25s(75*75mm,30bit,DMcode)
|
| Maximum PCB Size | 520*520mm |
| Flue Dust Retaine | The machine has a dust extraction port, which can dock with the central dust removal of the factory or independent smoke purifier
|
| Positioning system | CCD Camera with Visual positioning software
|
| Feed direction
|
Different directions can be set
|
| Air Pressure | 0.5-0.8Kpa, 30L-60L/min, Ouality (solid particle, water,gas):(2.2.3-2.4.3) ISO8573 |
| Voltage
|
220-250V/50-60Hz,32A, 3KW
|
| Water chiller
|
Automatic water chiller (pure or distilled water)
|
| Weight
|
650kg |
The laser beam’s effect on the PCB surface is primarily through thermal effects, evaporating or heating the surface coating or oxide layer to mark the PCB surface.
Machine type: Automatic PCB laser cutting machine (Depaneling machine)
Cutting range: any position on PCB
Function: Separated depanelized PCB from non-use part
Maximum working range: 520*520mm(adjustable)
Main application areas: PCB/FPC depaneling, precision electronic component cutting, micron-level drilling of flexible boards and ceramic sheets, cutting of PI film and PET film.

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