PICO-SECOND GLASS LASER CUTTING AND SPLITING MACHINE

Pico-second glass laser cutting machine is a device that uses ultrafast pulsed lasers in the infrared band (typically 1064nm) to perform high-precision processing on transparent and brittle materials.

Through a “cold processing” mechanism, it effectively solves problems such as edge chipping, cracking, and large heat-affected zones caused by traditional mechanical cutting.

Model: JL-G90-70100

Power: 90W

Descriptions

Item	Picosecond glass laser cutting and spliting machine
Laser source	90W 2.5mj (pico-second)
Laser cutting head	evenoptics
Maximum cutting size	1200700mm or 1300900mm
Processing accuracy	±5μm
Cutting thickness	White glass 12mm/Green 10mm
Laser wavelength	1064nm/10.6um
CO2 laser	Ai Lei 120W (actual output power is 150W)
Collapse	≤10μm
cutting speed	1-1000mm/s
Working environment	Temperature 20℃-35℃/humidity 20%-40%
Laser water machine temperature control	±0.1℃
Equipment size	210023001900
Weight	1000KG

PICO-SECOND GLASS LASER CUTTING AND SPLITING MACHINE WORKING PRINCIPLE:

Using high-power infrared picosecond laser + Bessel cutting system, maximum single cutting thickness 6mm (up to 12mm after two cuts). It has the advantages of good beam quality, small focused spot, and small power fluctuation.

It can quickly cut various optical glasses and has the advantages of fast cutting speed, small edge chipping and no taper. Precision optical path design ensures high-quality laser transmission, stable processing quality and equipment working stability.

PICO-SECOND GLASS LASER CUTTING AND SPLITING MACHINE ADVANTAGES:

High precision and high quality: Minimal edge chipping (typically within 10μm), resulting in a smooth cut surface with excellent perpendicularity.

No heat-affected zone: The extremely short pulse width ensures energy is applied before heat conduction, generating almost no thermal stress and preventing material deformation or microcracks.

High efficiency: Cutting speeds can reach over 500mm/s, typically eliminating the need for subsequent grinding or polishing processes, directly increasing yield and reducing costs.

Complex and irregular shape processing: Easily achieves precise cutting of complex patterns, small-radius arcs, and micro-holes, such as those found in mobile phone cover plates and camera lenses.